Magnetics Sensing Lead, Kilby Labs
Employment Type: Full-Time
Magnetics Device Engineer
* Job Description
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. We're committed to building a better future - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us - change the world, love your job!
Kilby Labs is looking for a qualified candidate to champion the co-design (ideation, simulation, prototype build-up, and verification) of state-of-the-art packaging for magnetic sensors. Kilby Labs represents a research organization within TI chartered to define new, innovate and valuable IP in collaboration with business units and customers. This research organization is afforded the freedom to take on more risky and disruptive IP development than typical product lines. Kilby engineers must have the ability to approach new and/or existing problems from a different perspective in a way that results in unique, highly disruptive and protectable solutions. Kilby engineers have the opportunity to participate in every aspect of the IP development including system definition, design, simulations, prototyping, bench evaluation, transfer to production, and customer visits. Kilby engineers are required to be self-motivated, critical thinkers, clear communicators, and be able to influence both technical and business leaders all within in team environments.
As a magnetics sensing lead for TI's Kilby Labs, you will be responsible for proposing and validating new ideas for sensor, sensor array, and transducer packaging for TI's magnetic and current sensor portfolio of products. This includes proposing packaging topologies to best account for product performance, cost, form factor, and reliability, taking into account co-design between mechanical and electrical/magnetic domains, and working with subcons and our internal packaging department to build and validate the packaging topologies.
Hands-on lab and fab/cleanroom experience running semiconductor and assembly process tools, and measuring performance of magnetic devices is a must. Experience with magnetic materials, magnetic sensing (Hall, AMR, GMR, TMR), current sensing, isolation, and a broad understanding of applications leveraging magnetics are important to this role. Exceptional candidates will demonstrate the ability to understand problems, propose and model unique solutions and evaluate their solutions through simulation and hardware prototypes. A fundamental knowledge of semiconductor and packaging structures, processes, and magnetics is a must. A knowledge of packaging subcon capabilities and the ability to work through subcons is also a must.
Specific responsibilities will include:
* Collaborate with IC designers and process technologists, internal and external foundries, and EDA experts, to implement integrate system constraints into the co-design of the package.
* Define package topology to account for product needs including performance, cost, and form factor
* Build and verify experimental prototypes to verify performance versus requirements
* Drive package innovation with internal assembly sites and external subcons to enable product roadmaps
This position can be located in Dallas, TX, Manchester, NH, Santa Clara, CA, or Tokyo Japan
To be considered for this position, please apply to this requisition.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity, or age.
* Bachelors in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
* 10+ years relevant work experience
* Possess a thorough understanding of the physics of magnetic devices as well as the analysis, materials, construction, design and operation of magnetic packaging
* Thorough knowledge of package modeling
* Thorough knowledge of package assembly processes
* Thorough knowledge of wafer-level package assembly processes
* Thorough knowledge of isolation requirements for packaging
* Proven track record of successfully demonstrating the design of new magnetic packaging
To be considered for this position, please apply to this requisition
If you are interested in this position, please apply to this requisition.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity or age.